The Hubless Nickel Dicing Blade for PCB

Product Description

    THis series blade is designed for the Printed Circuit Board material. Provide different diamond concentration for client to chooes, In processing hard and brittle materials, process quality is improved while blade life is maintained.


     1. 5 diamond concentration levels support diverse applications.

     2. The Series offers shorter precut times and lower chance of blade breakage due to flying die.

     3. The blade have a long life for  Printed Circuit Board material.


     The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 100~200μm
The blade precisiong Cutting material Abrasive size O.D.
2μm  PCB  600~3000# 54~58mm


   Slotting  specification:

Number Width(mm) Depth(mm)
8 0.5 1
16 1 2
32 1.2 3


   The cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~80mm/s 0.5~1.0mm

Company Info
  • Company Name: Suzhou Sail Science & Technology Co., Ltd.
  • Representative: Yun-long zhang
  • Product/Service: Nickel Dicing Blade , Metal-bond Dicing Blade , Resin Bond Blade , Grinding Diamond Wheels , Electroplated Diamond Wheels , Electroplated Diamond Drills
  • Capital (Million US $): 1711
  • Year Established: 2010
  • Total Annual Sales Volume (Million US $): Above US$100 Million
  • Export Percentage: 51% - 60%
  • Total Annual Purchase Volume (Million US $): Above US$100 Million
  • No. of Production Lines: 30
  • No. of R&D Staff: 31 -40 People
  • No. of QC Staff: 5 -10 People
  • OEM Services Provided: yes
  • Factory Size (Sq.meters): 3,000-5,000 square meters
  • Factory Location: 81#WEI XIN RD WEITING TOWN
  • Contact Person: Ms. Lisa
  • Tel: 86-0512-62968901

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