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PPTC Resettable Fuse Lp-ISM Series

Basic Info

Model No.:  LP-ISM series

Product Description

Model NO.: LP-ISM series Type: Resettable Fuse Shape: SMD Trademark: songshan HS Code: 85361000 Breaking Capacity: Low Usaga: Low Voltage Fusing Speed: F Origin: Shanghai, China Product description:Surface mount type PPTC products due to the small size, low resistance, the characteristics of standardization.It is the consumer electronics, multimedia, mobile equipment, computers and other areas of over-current protection program of choice.Existing from 0603 of various standard-size patch products:LP-ISM series sizes,in addition to the standard sizes, our company also offers customized patch products to meet individual design requirements.The rated operating current is between 0.05A and 6A, and the maximum voltage is between 6V and 30V.
LP-ISM series
 
 
Polymer PTC Re-settable Fuse Series           
Features                                                                Customized size and electrical characteristic available Surface mount packaging for automated assembly Radial-leaded devices for wave-soldering or manually assembly Fast tripping resettable circuit protection Product Dimensions for Surface-mounted Devices                                                 
Unit: mm
 
Part number
 
Dimension
 

 

 
 
A B C D E Figures for
Max. Max. Max. Min. Min.  Dimension
LP-ISM010 2.50 1.60 1.00 0.20 0.10 Fig.2
LP-ISM020 2.50 1.60 1.00 0.20 0.10 Fig.2
LP-ISM075 2.50 1.60 1.30 0.20 0.10 Fig.2
LP-ISM110 2.50 1.60 1.30 0.20 0.10 Fig.2

 
 
 
 

Thermal Derating Chart-IH(A)                                          

 
 
Part number
 
Hold current
-40ºC -20ºC 0ºC 25ºC 40ºC 50ºC 60ºC 70ºC 85ºC
LP-ISM010 0.14 0.13 0.12 0.10 0.09 0.08 0.07 0.06 0.04
LP-ISM020 0.29 0.25 0.23 0.20 0.17 0.15 0.14 0.12 0.08
LP-ISM075 1.09 0.99 0.86 0.75 0.64 0.56 0.51 0.45 0.34
LP-ISM110 1.59 1.45 1.25 1.10 0.94 0.83 0.75 0.65 0.51
   
Electrical Characteristics at 25ºC                                      
Part number
 
IH IT Vmax Imax Max. Time-to-trip Pd typ Rmin R1max Figures for
(A) (A) (V) (A) (A) (S) (W) (Ω) (Ω) Dimension
LP-ISM010 0.10 0.30 15 10 0.5 1.50 0.5 1.000 6.000 Fig.2
LP-ISM020 0.20 0.50 9 40 8.0 0.02 0.5 0.650 3.500 Fig.2
LP-ISM075 0.75 1.50 6 40 8.0 0.20 0.5 0.100 0.400 Fig.2
LP-ISM110 1.10 2.20 6 40 8.0 0.30 0.5 0.050 0.210 Fig.2
  
IH=Hold current: maximum current at which the device will not trip at 25ºC still air.
IT=Trip current: minimum current at which the device will always trip at 25ºC still air.
Vmax=Maximum voltage device can withstand without damage at rated current.
Imax=Maximum fault current device can withstand without damage at rated voltage.
Ttrip=Maximum time to trip at assigned current.
Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment.
Rmin=Minimum device resistance at 25ºC prior to tripping.
R1max=Maximum device resistance measured after 1 hour post one-time trip.

Part Numbering System                                                       
 
Product series
Hold Current
xxx-
Other necessary information
*
 
 
 

Test Procedures And Requirements                                                 
 
Test Test Conditions Accept/Reject Criteria
Resistance In still air @ 25ºC RminRRmax
Time to Trip Specified current, Vmax, 25ºC Tmaximum Time to Trip
Hold Current 30min, at IH No trip
Trip Cycle Life Vmax, Imax, 100cycles No arcing or burning
Trip Endurance Vmax, 24hours No arcing or burning
 
 
Application Requirements                                                            
Soldering recommendation:
* Methods: IR, Vapor phase oven, hot air oven, wave solder, soldering temperature should not exceed GB-T2423 request.
* Devices can be cleaned using standard industry methods and solvents.
Notes:
If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Storage:
The maximum ambient temperature shall not exceed 40ºC. Storage temperatures higher than 40ºC could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 70%. High humidity with high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.
Warning:
PPTC devices are intended for protection against occasional over-current or over-temperature fault conditions, and should not be used when repeated fault conditions are anticipated. Operation beyond maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
Notes:
The specification is intended to present application, product and technical data to assist the user in selecting PPTC circuit production devices. However, users should independently evaluate and test the suitability of each product. Wayon makes no warranties as to the accuracy or completeness of the information and disclaims any liability resulting from its use. Wayon's only obligations are those in the Wayon Standard Terms and Conditions of Sale and in no case will Wayon be liable for any incidental, indirect, or consequential damages arising from the sale, resale, or misuse of its products. Wayon reserves the right to change or update, without notice, any information contained in this specification.

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