Find The Printed Circuit Board Cutting,The Hubless Blade for PCB,The Myriametre Cutting Blade on Industry Directory, Reliable Manufacturer/Supplier/Factory from China.

Inquiry Basket (0)

The Latest Product Alerts Send Me

The Hubless Nickel Dicing Blade for PCB


  • The Hubless Nickel Dicing Blade for PCB

The Hubless Nickel Dicing Blade for PCB

    Payment Type: T/T
    Terms of Trade: FOB,CIF,CIP
  • Ms.  Lisa

Basic Info

Material: Diamond

Abrasive: Superabrasive

Shapes: Edge Shape

Types: Cutting Wheel

Cylindricity: <0.02

Circular Degree: <0.01

Technics: Electroplating

Working Style: Cutting

Product Description

THis series blade is designed for the Printed Circuit Board material. Provide different diamond concentration for client to chooes, In processing hard and brittle materials, process quality is improved while blade life is maintained.

Features:

1. 5 diamond concentration levels support diverse applications.

2. The Series offers shorter precut times and lower chance of blade breakage due to flying die.

3. The blade have a long life for Printed Circuit Board material.

The blade Specifications:

The blade bond Abrasive Thehnics The blade thickness
Nickel Diamond Eletroplating 100~200μm
The blade precisiong Cutting material Abrasive size O.D.
2μm PCB 600~3000# 54~58mm

Slotting specification:

Number Width(mm) Depth(mm)
8 0.5 1
16 1 2
32 1.2 3
64


The cutting parameters:

Spindle rate Feed speed cut depth
30~50K/min 10~80mm/s 0.5~1.0mm


  • 1
  • 2
  • 3
  • 4
  • 5
 

INTRODUCTION

Located in Suzhou industrial Park, Suzhou Sail Science & Technology Co., Ltd. is high-tech corporation specialized in the research, development, production and saies of ultra precision diamond and CBN tools used in the industry of semiconductor. On the purpose of " Break techinc monopolization and replace imported ", the company brings high-tech professionals together and uses modern products of resin bonded metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used in cutting, slotting, dicing, wafering, back-thinning, CMP, array TEG, PCB and other precision processing in the industry of semiconductor. In addition, these products are also used in optical glass industry high-end market OGS, TOL, GF processing low-end market.

In 2011 the company was awarded the[high-tech enterprise"and[Suzhou leading talent Enterprise"is the China Semiconductor Industry Association. The company has passed ISO9001:2008 quality system certification.

Company Info
  • Company Name: Suzhou Sail Science & Technology Co., Ltd.
  • Representative: Yun-long zhang
  • Product/Service: Nickel Dicing Blade , Metal-bond Dicing Blade , Resin Bond Blade , Grinding Diamond Wheels , Electroplated Diamond Wheels , Electroplated Diamond Drills
  • Capital (Million US $): 1711
  • Year Established: 2010
  • Total Annual Sales Volume (Million US $): Above US$100 Million
  • Export Percentage: 51% - 60%
  • Total Annual Purchase Volume (Million US $): Above US$100 Million
  • No. of Production Lines: 30
  • No. of R&D Staff: 31 -40 People
  • No. of QC Staff: 5 -10 People
  • OEM Services Provided: yes
  • Factory Size (Sq.meters): 3,000-5,000 square meters
  • Factory Location: 81#WEI XIN RD WEITING TOWN
  • Contact Person: Ms. Lisa
  • Tel: 86-0512-62968901