The Hubless Nickel Dicing Blade for PCB
Product Description
THis series blade is designed for the Printed Circuit Board material. Provide different diamond concentration for client to chooes, In processing hard and brittle materials, process quality is improved while blade life is maintained.
Features:
1. 5 diamond concentration levels support diverse applications.
2. The Series offers shorter precut times and lower chance of blade breakage due to flying die.
3. The blade have a long life for Printed Circuit Board material.
The blade Specifications:
The blade bond | Abrasive | Thehnics | The blade thickness |
Nickel | Diamond | Eletroplating | 100~200μm |
The blade precisiong | Cutting material | Abrasive size | O.D. |
2μm | PCB | 600~3000# | 54~58mm |
Slotting specification:
Number | Width(mm) | Depth(mm) |
8 | 0.5 | 1 |
16 | 1 | 2 |
32 | 1.2 | 3 |
64 | | |
The cutting parameters:
Spindle rate | Feed speed | cut depth |
30~50K/min | 10~80mm/s | 0.5~1.0mm |
Product Categories : The Blade Series > The Hubless Nickel Dicing Blade